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ams OSRAM

Austria / Global

Senior RF IC Package & PCB Layout Engineer

Job Description

ams OSRAM is seeking an experienced RF and high-frequency IC layout engineer in Austria. You will design and optimize RF/mixed-signal substrate and PCB layouts, ensuring SI/PI performance and manufacturability while coordinating with EMC, analog, package, and IC design teams.

The role requires 6+ years in semiconductor/electronic industries, strong Cadence Allegro and/or Altium experience, and knowledge of RF matching networks and packaging technologies.

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