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OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

Austria / Global

Staff Engineer: 3D TSV Process & Integration Leader

Job Description

ams OSRAM AG in Austria seeks a specialist to advance wafer-level integration, collaborating with internal and external fabs to design and implement process modules.

You will lead projects, define experiments, analyze data, and document results while ensuring quality and timely delivery. The candidate should have an advanced degree and strong TSV/3D integration experience, with excellent English communication and teamwork.

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