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Infineon Technologies AG

at / Global

Senior Staff Engineer, Chip-Package Co-Design & Simulation

Job Description

Infineon Technologies AG in Austria invites an experienced Staff Engineer to shape next‑gen CPB co‑design methodologies and simulation‑driven packaging. You will develop and support CPB co‑design flows, enable multi‑physics simulations, and drive tool environments in Linux‑based HPC settings.

You will collaborate with business lines and design teams worldwide, own the simulation environment, mentor engineers, and push automation and ML/AI integration for increasingly complex packaging

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